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dc.contributor.author Cao, Y.
dc.contributor.author Allameh, S.
dc.contributor.author Sethiaraj, S.
dc.date.accessioned 2010-07-08T13:02:25Z
dc.date.available 2010-07-08T13:02:25Z
dc.date.issued 2006
dc.identifier.citation Cao, Y. et al (2006) Nanoindentation measurements of the mechanical properties of polycrystalline Au and Ag thin films on silicon substrates: Effects of grain size and film thickness, Materials Science and Engineering, Vol. 427, pp. 232-240 en_US
dc.identifier.uri http://hdl.handle.net/10311/537
dc.description.abstract This paper presents the results of nanoindentation experimental studies of the contact-induced deformation in Au and Ag thin films. The paper examines the effects of film thickness and substrate deformation restraint on the mechanical properties of electron beam (e-beam) deposited Au and Ag films. Following a brief description of film microstructure, surface topography, and contact-induced pile-up deformation, film mechanical properties (hardness and Young’s modulus) were determined using nanoindentation techniques. The indentation size effects (ISE) observed in films with different thicknesses were explained using a mechanism-based strain gradient (MSG) theory. The intrinsic film yield strengths and hardnesses extracted from the MSG theory are shown to exhibit classical Hall–Petch dependence on the inverse square root of the average film grain size. Displacement bursts were also found to occur in Ag films at indentation load levels of 100 N. These were attributed to the initial onset of dislocation slip activity, when the shear stress exceeds the estimated theoretical shear strengths of the materials. en_US
dc.language.iso en en_US
dc.publisher Elsevier en_US
dc.subject Nanoindentation en_US
dc.subject Fcc thin films en_US
dc.subject Hardness en_US
dc.subject Young’s modulus en_US
dc.subject Hall–Petch effects en_US
dc.subject Thickness effect en_US
dc.title Nanoindentation measurements of the mechanical properties of polycrystalline Au and Ag thin films on silicon substrates: Effects of grain size and film thickness en_US
dc.type Published Article en_US


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